IP Library › Assignment 029432/0679
Patent Assignment
Reel/Frame 029432/0679

Assignment of Assignor's Interest

Recorded: 2012-12-09 Pages: 4
Assignors
LIN, YEN-LIANG
Executed: 2012-07-06
CHEN, CHEN-SHIEN
Executed: 2012-07-06
KUO, TIN-HAO
Executed: 2012-07-06
WU, SHENG-YU
Executed: 2012-07-06
LIN, TSUNG-SHU
Executed: 2012-07-06
HUANG, CHANG-CHIA
Executed: 2012-07-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Elongated Bumps in Integrated Circuit Devices
Patent: 8,922,006 →
Application: 13/559,840 →
Publication: US 2013/0256874
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →