Patent Assignment
Reel/Frame 029537/0749
Assignment of Assignor's Interest
Recorded: 2012-12-21
Pages: 4
Assignors
PARK, JOON YOUNG
Executed: 2012-12-20
JEONG, JIN SUK
Executed: 2012-12-21
SEONG, KYEONG SOOL
Executed: 2012-12-20
LEE, SEO WON
Executed: 2012-12-20
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Semiconductor Package with Alternating Thermal Interface and Adhesive Materials and Method for Manufacturing the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →