Patent Assignment
Reel/Frame 029575/0811
Assignment of Assignor's Interest
Recorded: 2013-01-07
Pages: 3
Assignors
MATEJAT, KAI-JENS
Executed: 2012-12-03
LAMPRECHT, SVEN
Executed: 2012-12-03
EWERT, INGO
Executed: 2012-12-07
SCHOENENBERGER, CATHERINE
Executed: 2012-12-04
KRESS, JURGEN
Executed: 2012-11-30
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, 10553, GERMANY
Covered Property
(1)
Method to Form Solder Deposits and Non-Melting Bump Structures on Substrates
Application:
13/808,655 →
Publication:
US 2013/0105329
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 1, 2017
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA INC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 041590/0001 →
Release of Security Interest
Mar 18, 2021
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
Reel/Frame 055653/0714 →