Patent Assignment
Reel/Frame 029580/0502
Assignment of Assignor's Interest
Recorded: 2013-01-07
Pages: 2
Assignors
CHUANG, YAO-CHUN
Executed: 2013-01-02
CHUANG, CHITA
Executed: 2013-01-02
TSENG, MING HUNG
Executed: 2013-01-02
CHEN, CHEN-SHIEN
Executed: 2013-01-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Elongated Bump Structures in Package Structure