IP Library Assignment 029614/0892
Patent Assignment
Reel/Frame 029614/0892

Assignment of Assignor's Interest

Recorded: 2013-01-11 Pages: 4
Assignors
KIM, DONG IN
Executed: 2013-01-11
LEE, JAE UNG
Executed: 2013-01-11
CHO, EUNNARA
Executed: 2013-01-11
KIM, MIN JU
Executed: 2013-01-11
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property (1)
Semiconductor Package and Manufacturing Method Thereof
Patent: 9,018,741 →
Application: 13/739,565 →
Publication: US 2013/0154066
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →