Patent Assignment
Reel/Frame 029634/0143
Assignment of Assignor's Interest
Recorded: 2013-01-15
Pages: 3
Assignor
KANG, TECKGYU
Executed: 2012-12-21
Assignee
NVIDIA CORPORATION
2701 SAN TOMAS EXPRESSWAY, SANTA CLARA, CALIFORNIA, 95050
Covered Property
(1)
Chip Package Using Interposer Substrate with Through-Silicon Vias