IP Library › Assignment 029647/0458
Patent Assignment
Reel/Frame 029647/0458

Assignment of Assignor's Interest

Recorded: 2013-01-17 Pages: 3
Assignor
PULSE MEMS APS
Executed: 2012-07-30
Assignee
EPCOS PTE LTD
166 KALLANG WAY, SINGAPORE, 349249, SINGAPORE
Covered Properties (2)
Miniature microphone assembly with hydrophobic surface coating
Patent: 8,542,850 →
Application: 12/231,398 →
Publication: US 2009/0067659
Miniature Microphone Assembly with Solder Sealing Ring
Patent: 8,406,437 →
Application: 12/389,011 →
Publication: US 2009/0214061
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 30, 2008
From: WANG, CHRISTIAN; REHDER, JORG; JOHANSEN, LEIF STEEN; SCHEEL, PETER ULRIK
To: PULSE MEMS APS (FORMERLY SONION MEMS A/S)
Reel/Frame 021765/0143 →
Assignment of Assignor's Interest Apr 28, 2009
From: JOHANSEN, LEIF STEEN; HOVESTEN, PER F.; ROCCA, GINO
To: PULSE MEMS APS.
Reel/Frame 022602/0723 →
Assignment of Assignor's Interest Jan 31, 2017
From: EPCOS PTE LTD
To: TDK CORPORATION
Reel/Frame 041132/0144 →
Assignment of Assignor's Interest Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →