Patent Assignment
Reel/Frame 029663/0031
Assignment of Assignor's Interest
Recorded: 2013-01-21
Pages: 4
Assignors
LU, CHUN-LIN
Executed: 2012-11-29
WU, KAI-CHIANG
Executed: 2012-11-29
WANG, YEN-PING
Executed: 2012-11-29
LIANG, SHIH-WEI
Executed: 2012-11-29
YANG, CHING-FENG
Executed: 2012-11-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Methods and Apparatus for Package with Interposers