Patent Assignment
Reel/Frame 029666/0173
Assignment of Assignor's Interest
Recorded: 2013-01-22
Pages: 4
Assignor
MEYER, THORSTEN
Executed: 2013-01-09
Assignee
INTEL MOBILE COMMUNICATIONS GMBH
AM CAMPEON 10-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Flip-Chip Wafer Level Package and Methods Thereof
Patent:
8,729,714 →
Application:
13/731,123 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 6, 2015
From: INTEL MOBILE COMMUNICATIONS GMBH
To: INTEL DEUTSCHLAND GMBH
Reel/Frame 037057/0061 →
Assignment of Assignor's Interest
Aug 29, 2022
From: INTEL DEUTSCHLAND GMBH
To: INTEL CORPORATION
Reel/Frame 061356/0001 →
Assignment of Assignor's Interest
Nov 1, 2022
From: INTEL CORPORATION
To: TAHOE RESEARCH, LTD.
Reel/Frame 061827/0686 →