Flip-chip wafer level package and methods thereof

1. An electronic package comprising:

a flip-chip component having a first die coupled to a flip-chip substrate;

a second die stacked on the first die;

an encapsulation compound formed around the first die and the second die;

a set of through encapsulant vias (TEVs) providing a set of electrical connections from a first side of the electronic package to a second side of the electronic package through the encapsulation compound to the flip-chip substrate;

a redistribution layer electrically connecting a set of contacts on the second die to the set of TEVs on the first side of the electronic package;

a protection layer consistently and continuously covering at least a surface of the redistribution layer facing away from the flip-chip substrate; and

a plurality of solder balls adhered to a single side of the electronic package at a surface of the flip-chip substrate facing away from the first die.

2. The electronic package in claim 1 , further comprising a set of additional dies stacked on the first die of the flip-chip component.

3. The electronic package in claim 1 , wherein a set of contacts of the first die are arranged opposite of the set of contacts of the second die.

4. The electronic package in claim 1 , wherein the redistribution layer is a thin film layer.

5. The electronic package in claim 1 , wherein the distance between the set of contacts on the second die and a surface of the first side of the electronic package is less than about 20 μm.

6. The electronic package in claim 1 , further comprising a dielectric layer between the second die and the redistribution layer.

7. A memory device comprising:

a flip-chip component having a first die coupled to a flip-chip substrate;

a second die stacked on the first die;

an encapsulation compound formed around the first die and the second die;

a set of through encapsulant vias (TEVs) providing a set of electrical connections from a first side of the electronic package to a second side of the electronic package through the encapsulation compound to the flip-chip substrate; and

a redistribution layer electrically connecting a set of contacts on the second die to the set of TEVs on the first side of the electronic package;

a protection layer consistently and continuously covering at least a surface of the redistribution layer facing away from the flip-chip substrate; and

a plurality of solder balls adhered to a single side of the electronic package at a surface of the flip-chip substrate facing away from the first die,

wherein at least one of the group consisting of the first die and the second die includes a memory function.

8. An electronic package comprising:

a first electronic package; and

a second electronic package comprising:

a flip-chip component having a first die coupled to a flip-chip substrate;

a second die stacked on the first die;

an encapsulation compound formed around the first die and the second die;

a set of through encapsulant vias (TEVs) providing a set of electrical connections from a first side of the electronic package to a second side of the electronic package through the encapsulation compound to the flip-chip substrate; and

a redistribution layer electrically connecting a set of contacts on the second die to the set of TEVs on the first side of the electronic package;

a protection layer consistently and continuously covering at least a surface of the redistribution layer facing away from the flip-chip substrate; and

a plurality of solder balls adhered to a single side of the electronic package at a surface of the flip-chip substrate facing away from the first die,

wherein the first electronic package is stacked together with the second electronic package to form a package-on-package (PoP) electronic package.