Patent Assignment
Reel/Frame 029757/0829
Assignment of Assignor's Interest
Recorded: 2013-02-05
Pages: 5
Assignors
BAYRAM, CAN
Executed: 2013-01-30
CHU, JACK O.
Executed: 2013-01-29
DIMITRAKOPOULOS, CHRISTOS
Executed: 2013-01-29
KIM, JEEHWAN
Executed: 2013-01-29
PARK, HONGSIK
Executed: 2013-01-30
SADANA, DEVENDRA K.
Executed: 2013-01-30
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Thin Film Wafer Transfer and Structure for Electronic Devices