Patent Assignment
Reel/Frame 029836/0204
Assignment of Assignor's Interest
Recorded: 2013-02-18
Pages: 6
Assignors
LEE, HO-JIN
Executed: 2013-01-28
KANG, PIL-KYU
Executed: 2013-01-30
LEE, KYU-HA
Executed: 2013-01-30
PARK, BYUNG-LYUL
Executed: 2013-01-30
CHUNG, HYUN-SOO
Executed: 2013-01-29
CHOI, GIL-HEYUN
Executed: 2013-01-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Via Connection Structures, Semiconductor Devices Having the Same, and Methods of Fabricating the Structures and Devices