IP Library › Assignment 029838/0858
Patent Assignment
Reel/Frame 029838/0858

Assignment of Assignor's Interest

Recorded: 2013-02-20 Pages: 3
Assignors
CHOU, E-TUNG
Executed: 2013-01-22
HSIAO, CHIH-JEN
Executed: 2013-01-21
Assignee
ZHEN DING TECHNOLOGY CO., LTD.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Property (1)
Circuit Substrate for Mounting Chip, Method for Manufacturing Same and Chip Package Having Same
Patent: 8,951,848 →
Application: 13/771,320 →
Publication: US 2014/0027893
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 22, 2016
From: ZHEN DING TECHNOLOGY CO., LTD.
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 039822/0439 →
Assignment of Assignor's Interest Sep 14, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 064899/0050 →