IP Library Assignment 064899/0050
Patent Assignment
Reel/Frame 064899/0050

Assignment of Assignor's Interest

Recorded: 2023-09-14 Pages: 6
Assignors
ZHEN DING TECHNOLOGY CO., LTD.
Executed: 2023-08-01
Assignees
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18-2 TENGFEI ROAD,ECONOMY AND TECHNOLOGY DEVELOPMENT ZONE, QINHUANGDAO CITY, CHINA
ZHEN DING TECHNOLOGY CO., LTD.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Properties (29)
Circuit Substrate for Mounting Chip, Method for Manufacturing Same and Chip Package Having Same
Patent: 8,951,848 →
Application: 13/771,320 →
Publication: US 2014/0027893
Package on Package Structrue and Method for Manufacturing Same
Patent: 8,853,000 →
Application: 13/777,043 →
Publication: US 2014/0061903
Method for Manufacturing Printed Circuit Baord
Patent: 9,107,332 →
Application: 13/864,232 →
Publication: US 2014/0054075
Method for Manufacturing Ic Substrate
Patent: 9,015,936 →
Application: 13/891,204 →
Publication: US 2013/0318785
Method for Manufacturing a Multi-Layer Circuit Board
Patent: 9,265,146 →
Application: 13/925,136 →
Publication: US 2014/0000950
Embedded Printed Circuit Board and Method for Manufacturing Same
Patent: 9,024,203 →
Application: 13/928,701 →
Publication: US 2014/0124245
Method for Manufacturing Printed Circuit Board
Patent: 9,439,281 →
Application: 13/947,114 →
Publication: US 2014/0060902
Method for Manufacturing Printed Circuit Board
Patent: 9,439,282 →
Application: 13/949,237 →
Publication: US 2014/0083744
Packaging Substrate, Method for Manufacturing Same, and Chip Packaging Body Having Same
Patent: 9,165,790 →
Application: 13/968,409 →
Publication: US 2014/0117553
Packaging Substrate, Method for Manufacturing Same, and Chip Packaging Body Having Same
Patent: 9,357,647 →
Application: 13/971,854 →
Publication: US 2014/0078706
Method for Manufacturing a Printed Circuit Board
Patent: 9,295,150 →
Application: 14/035,957 →
Publication: US 2014/0083757
Interposer and Package on Package Structure
Patent: 9,271,388 →
Application: 14/064,202 →
Publication: US 2014/0118951
Package Structure and Method for Manufacturing Same
Patent: 9,099,450 →
Application: 14/084,627 →
Publication: US 2014/0300009
Packaging Substrate, Method for Manufacturing Same, and Chip Packaging Structure Having Same
Patent: 9,173,298 →
Application: 14/097,251 →
Publication: US 2014/0185259
Package Structure and Method for Manufacturing Same
Patent: 8,941,227 →
Application: 14/101,352 →
Publication: US 2014/0175646
Printed Circuit Board with Embedded Component and Method for Manufactruing Same
Patent: 9,089,082 →
Application: 14/109,913 →
Publication: US 2014/0182892
Printed Circuit Board with Embedded Component and Method for Manufacturing Same
Patent: 9,730,328 →
Application: 14/138,126 →
Publication: US 2014/0185257
Substrate, Chip Package and Method for Manufacturing Substrate
Patent: 9,190,386 →
Application: 14/139,790 →
Publication: US 2015/0024552
Packaging Substrate and Method for Manufacturing Same
Patent: 9,159,614 →
Application: 14/140,461 →
Publication: US 2014/0361439
Interposer and Method for Manufacturing Same
Patent: 9,332,656 →
Application: 14/150,723 →
Publication: US 2015/0136457
Coreless Package Structure and Method for Manufacturing Same
Patent: 9,362,248 →
Application: 14/331,330 →
Publication: US 2015/0014849
Package on Package Structure and Method for Manufacturing Same
Patent: 9,000,573 →
Application: 14/477,888 →
Publication: US 2014/0374894
Heat Sink, Method for Making the Same, and Electronic Device Having the Same
Patent: 9,855,629 →
Application: 14/834,673 →
Publication: US 2016/0381833
Packaging Substrate and Method for Manufacturing Same
Patent: 9,472,426 →
Application: 14/841,721 →
Publication: US 2015/0371873
Method for Manufacturing Package Structure
Patent: 9,786,589 →
Application: 14/857,020 →
Publication: US 2016/0181181
Package Structure and Method for Manufacturing Same
Patent: 9,548,427 →
Application: 14/864,585 →
Publication: US 2016/0351753
Method of Manufacturing a Package Substrate
Patent: 9,992,873 →
Application: 14/967,907 →
Publication: US 2017/0127519
Package Structure
Patent: 9,905,508 →
Application: 15/693,198 →
Publication: US 2017/0365540
Package Substrate
Application: 15/953,560 →
Publication: US 2018/0235085
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 20, 2013
From: CHOU, E-TUNG; HSIAO, CHIH-JEN
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 029838/0858 →
Assignment of Assignor's Interest Feb 27, 2013
From: CHEN, CHIEN-CHIH; SHI, HONG-XIA; HSU, SHIH-PING
To: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO.,LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 029881/0428 →
Assignment of Assignor's Interest Apr 17, 2013
From: HU, WEN-HUNG
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 030228/0452 →
Assignment of Assignor's Interest May 13, 2013
From: HSU, CHE-WEI; HSU, SHIH-PING
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 030399/0182 →
Assignment of Assignor's Interest Jun 26, 2013
From: HSU, CHE-WEI; HSU, SHIH-PING
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 030685/0265 →
Assignment of Assignor's Interest Jun 27, 2013
From: LAI, CHIEN-KUANG
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 030702/0063 →
Assignment of Assignor's Interest Jul 22, 2013
From: HU, WEN-HUNG
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 030844/0241 →
Assignment of Assignor's Interest Jul 24, 2013
From: HU, WEN-HUNG
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 030871/0296 →
Assignment of Assignor's Interest Aug 15, 2013
From: HA WOO, YONG; CHOU, E-TUNG; LO, WEN-LUN
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 031022/0667 →
Assignment of Assignor's Interest Aug 21, 2013
From: HU, CHU-CHIN; HSU, SHIH-PING; CHOU, E-TUNG; HSIAO, CHIH-JEN
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 031057/0570 →
Assignment of Assignor's Interest Sep 25, 2013
From: HU, WEN-HUNG
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 031273/0024 →
Assignment of Assignor's Interest Jul 29, 2014
From: HSU, SHIH-PING
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 033406/0519 →
Assignment of Assignor's Interest Aug 7, 2014
From: HA WOO, YONG; CHOU, E-TUNG; LO, WEN-LUN
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 033481/0253 →
Assignment of Assignor's Interest Aug 11, 2014
From: LEE, TAEKOO
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 033502/0509 →
Assignment of Assignor's Interest Aug 12, 2014
From: HSU, SHIH-PING
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 033520/0433 →
Assignment of Assignor's Interest Aug 28, 2014
From: HSU, SHIH-PING
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 033626/0172 →
Assignment of Assignor's Interest Aug 29, 2014
From: HSU, SHIH-PING
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 033635/0293 →
Assignment of Assignor's Interest Sep 21, 2016
From: ZHEN DING TECHNOLOGY CO., LTD.
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 039806/0499 →
Assignment of Assignor's Interest Sep 21, 2016
From: ZHEN DING TECHNOLOGY CO., LTD.
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 039806/0423 →
Assignment of Assignor's Interest Sep 22, 2016
From: ZHEN DING TECHNOLOGY CO., LTD.
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 039822/0436 →
Assignment of Assignor's Interest Sep 22, 2016
From: ZHEN DING TECHNOLOGY CO., LTD.
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 039822/0519 →
Assignment of Assignor's Interest Sep 22, 2016
From: ZHEN DING TECHNOLOGY CO., LTD.
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 039822/0506 →
Assignment of Assignor's Interest Sep 22, 2016
From: ZHEN DING TECHNOLOGY CO., LTD.
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 039822/0503 →
Assignment of Assignor's Interest Sep 22, 2016
From: ZHEN DING TECHNOLOGY CO., LTD.
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 039822/0500 →
Assignment of Assignor's Interest Sep 22, 2016
From: ZHEN DING TECHNOLOGY CO., LTD.
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 039822/0495 →