Patent Assignment
Reel/Frame 029881/0428
Assignment of Assignor's Interest
Recorded: 2013-02-27
Pages: 6
Assignors
CHEN, CHIEN-CHIH
Executed: 2013-01-21
SHI, HONG-XIA
Executed: 2013-01-21
HSU, SHIH-PING
Executed: 2013-01-21
Assignees
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO.,LTD.
NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, QINHUANGDAO, CHINA
ZHEN DING TECHNOLOGY CO., LTD.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Property
(1)
Package on Package Structrue and Method for Manufacturing Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 22, 2016
From: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO.,LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 039822/0429 →
Assignment of Assignor's Interest
Sep 14, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 064899/0050 →