IP Library › Assignment 039822/0429
Patent Assignment
Reel/Frame 039822/0429

Assignment of Assignor's Interest

Recorded: 2016-09-22 Pages: 4
Assignors
ZHEN DING TECHNOLOGY CO., LTD.
Executed: 2016-09-02
Assignees
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, QINHUANGDAO, CHINA
ZHEN DING TECHNOLOGY CO., LTD.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Property (1)
Package on Package Structrue and Method for Manufacturing Same
Patent: 8,853,000 →
Application: 13/777,043 →
Publication: US 2014/0061903
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 27, 2013
From: CHEN, CHIEN-CHIH; SHI, HONG-XIA; HSU, SHIH-PING
To: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO.,LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 029881/0428 →
Assignment of Assignor's Interest Sep 14, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 064899/0050 →