IP Library › Assignment 039822/0506
Patent Assignment
Reel/Frame 039822/0506

Assignment of Assignor's Interest

Recorded: 2016-09-22 Pages: 3
Assignor
ZHEN DING TECHNOLOGY CO., LTD.
Executed: 2016-09-02
Assignees
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, QINHUANGDAO, CHINA
ZHEN DING TECHNOLOGY CO., LTD.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Property (1)
Packaging Substrate, Method for Manufacturing Same, and Chip Packaging Structure Having Same
Patent: 9,173,298 →
Application: 14/097,251 →
Publication: US 2014/0185259
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 7, 2014
From: HA WOO, YONG; CHOU, E-TUNG; LO, WEN-LUN
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 033481/0253 →
Assignment of Assignor's Interest Sep 14, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 064899/0050 →