Patent Assignment
Reel/Frame 033481/0253
Assignment of Assignor's Interest
Recorded: 2014-08-07
Pages: 5
Assignors
HA WOO, YONG
Executed: 2013-11-19
CHOU, E-TUNG
Executed: 2013-11-21
LO, WEN-LUN
Executed: 2013-11-19
Assignee
ZHEN DING TECHNOLOGY CO., LTD.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Property
(1)
Packaging Substrate, Method for Manufacturing Same, and Chip Packaging Structure Having Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 22, 2016
From: ZHEN DING TECHNOLOGY CO., LTD.
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 039822/0506 →
Assignment of Assignor's Interest
Sep 14, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 064899/0050 →