Patent Assignment
Reel/Frame 031057/0570
Assignment of Assignor's Interest
Recorded: 2013-08-21
Pages: 7
Assignors
HU, CHU-CHIN
Executed: 2013-08-10
HSU, SHIH-PING
Executed: 2013-07-22
CHOU, E-TUNG
Executed: 2013-07-30
HSIAO, CHIH-JEN
Executed: 2013-07-30
Assignee
ZHEN DING TECHNOLOGY CO., LTD.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Property
(1)
Packaging Substrate, Method for Manufacturing Same, and Chip Packaging Body Having Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 14, 2016
From: ZHEN DING TECHNOLOGY CO., LTD.
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 040011/0764 →
Assignment of Assignor's Interest
Sep 14, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 064899/0050 →