Merger/Change of Name

Recorded: 2013-02-22 Pages: 11

Assignor

RENESAS TECHNOLOGY CORP.

Executed: 2010-04-01

Assignee

RENESAS ELECTRONICS CORPORATION

1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN

Covered Property (1)

Pb-Free Solder-Connected Structure and Electronic Device

Patent: 8,503,189 →

Application: 12/773,128 →

Publication: US 2010/0214753

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.