Patent Assignment
Reel/Frame 029868/0413
Assignment of Assignor's Interest
Recorded: 2013-02-25
Pages: 2
Assignors
WU, JIANN LIH
Executed: 2012-11-29
HWANG, JENG-JYI
Executed: 2012-11-29
HUANG, SOON-KANG
Executed: 2012-11-29
YANG, CHI-MING
Executed: 2012-11-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Multi-Point Chemical Mechanical Polishing End Point Detection System and Method of Using