Patent Assignment
Reel/Frame 029892/0832
Assignment of Assignor's Interest
Recorded: 2013-02-28
Pages: 8
Assignors
KIM, JEEYONG
Executed: 2012-10-03
BACK, HYUNCHUL
Executed: 2012-10-04
LEE, JUNG-HWAN
Executed: 2012-10-04
LEE, HYUNMIN
Executed: 2012-10-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including Interconnections Insulated by Air Gaps and Methods of Fabricating the Same