IP Library Assignment 029922/0703
Patent Assignment
Reel/Frame 029922/0703

Corrective Assignment to Correct the Second Inventor's Last Name to Read: Yeung Previously Recorded on Reel 029902 Frame 0262. Assignor(S) Hereby Confirms the Assignment of Assignors Interest.

Recorded: 2013-03-05 Pages: 6
Assignors
SARANGAPANI, MURALI
Executed: 2012-12-12
YEUNG, PING HA
Executed: 2012-12-12
MILKE, EUGEN
Executed: 2012-12-18
Assignee
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
HERAEUSSTRASSE 12-14, HANAU, D-63450, GERMANY
Covered Property (1)
Alloyed 2N Copper Wires for Bonding in Microelectronics Devices
Patent: 9,589,694 →
Application: 13/690,701 →
Publication: US 2013/0140084
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 1, 2013
From: SARANGAPANI, MURALI; YUENG, PING HA; MILKE, EUGEN
To: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Reel/Frame 029902/0262 →
Change of Name May 19, 2015
From: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 035744/0381 →