IP Library › Assignment 029935/0685
Patent Assignment
Reel/Frame 029935/0685

Assignment of Assignor's Interest

Recorded: 2013-03-06 Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2013-03-01
LIN, MENG-LIANG
Executed: 2013-03-01
GAU, JY-JIE
Executed: 2013-03-01
HUANG, CHENG-LIN
Executed: 2013-03-01
LIN, JING-CHENG
Executed: 2013-03-01
HSU, KUO-CHING
Executed: 2013-03-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Bump Structures for Semiconductor Package
Patent: 9,343,419 →
Application: 13/787,465 →
Publication: US 2014/0167254
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →