Patent Assignment
Reel/Frame 029938/0355
Assignment of Assignor's Interest
Recorded: 2013-03-07
Pages: 4
Assignors
SARANGAPANI, MURALI
Executed: 2012-12-12
YEUNG, PING HA
Executed: 2012-12-12
MILKE, EUGEN
Executed: 2012-12-18
Assignee
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
HERAEUSSTRASSE 12-14, HANAU, D-63450, GERMANY
Covered Property
(1)
Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics Devices
Application:
13/688,784 →
Publication:
US 2013/0140068
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.