IP Library › Assignment 029957/0027
Patent Assignment
Reel/Frame 029957/0027

Assignment of Assignor's Interest

Recorded: 2013-03-08 Pages: 3
Assignors
LIN, SHIH HSIUNG
Executed: 2003-10-20
LIN, MOU SHIUNG
Executed: 2003-10-20
Assignee
MEGIC CORPORATION
NO. 21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK HSINCHU, TAIWAN
Covered Property (1)
A Chip Package Having a Chip Combined with a Substrate via a Copper Pillar
Patent: 8,421,222 →
Application: 13/207,350 →
Publication: US 2011/0291275
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 8, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 029957/0039 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →