IP Library › Assignment 029957/0039
Patent Assignment
Reel/Frame 029957/0039

Assignment of Assignor's Interest

Recorded: 2013-03-08 Pages: 4
Assignor
MEGIC CORPORATION
Executed: 2006-04-28
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK HSINCHU, TAIWAN
Covered Property (1)
A Chip Package Having a Chip Combined with a Substrate via a Copper Pillar
Patent: 8,421,222 →
Application: 13/207,350 →
Publication: US 2011/0291275
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 8, 2013
From: LIN, SHIH HSIUNG; LIN, MOU SHIUNG
To: MEGIC CORPORATION
Reel/Frame 029957/0027 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →