Patent Assignment
Reel/Frame 030020/0957
Assignment of Assignor's Interest
Recorded: 2013-03-15
Pages: 10
Assignors
LEE, JAE CHUN
Executed: 2013-02-15
PAIK, KYUNG-WOOK
Executed: 2013-02-15
KIM, YOO SUN
Executed: 2013-02-15
LEE, KIWON
Executed: 2013-02-15
Assignees
LG INNOTEK CO., LTD.
20TH FL. SEOUL SQUARE 541 NAMDAEMUNNO 5-GA JUNG-GU, SEOUL, 100-714, KOREA, REPUBLIC OF
KAIST (KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY)
373-1 GUSEONG-DONG YUSEONG-GU, DAEJEON, 305-701, KOREA, REPUBLIC OF
Covered Property
(1)
Device for Bonding Flexible Pcb to Camera Module