Device for bonding flexible PCB to camera module
Disclosed is a device for bonding a flexible PCB (Printed Circuit Board) to a camera module, the device according to an exemplary embodiment of the present disclosure comprising a thermo-compression unit configured to bond the camera module to the flexible PCB using an conductive film by applying heat and pressure to the conductive film between the camera module and the flexible PCB, an ultrasonic wave bonding unit configured to directly transmit ultrasonic wave vibration energy to the camera module to remove an oxide film on connection particles intrinsically formed inside the conducive film, and a controller configured to activate the ultrasonic wave bonding unit when a temperature of the conductive film rises to a predetermined temperature.
1. A device for bonding a flexible printed circuit board (PCB) to a camera module, the device comprising:
a thermo-compression unit configured to apply heat and pressure to a conductive film between the camera module and the flexible PCB, the conductive film including an insulating polymer resin and conductive particles;
an ultrasonic wave bonding unit configured to apply an ultrasonic wave to the conductive film;
a memory configured to store a first period for which the thermo-compression unit applies heat and pressure to the conductive film and a second period for which the ultrasonic wave bonding unit applies the ultrasonic wave to the conductive film while the thermo-compression unit maintains application of heat and pressure; and
a controller configured to:
control the thermo-compression unit to apply the heat and pressure to the conductive film for the first period;
control the ultrasonic wave bonding unit to apply the ultrasonic wave to the conductive film for the second period after the first period while the thermo-compression unit maintains application of heat and pressure; and
control the thermo-compression unit to maintain application of the heat and pressure to the conductive film after the second period until the insulating polymer resin of the conductive film is cured.
2. The device of claim 1 , wherein the insulating polymer resin includes any one of epoxy resin, polyimide resin, acrylic resin, polyester resin, polysulfone resin and polystyrene resin, or a mixture of two or more selected from the epoxy resin, polyimide resin, acrylic resin, polyester resin, polysulfone resin and polystyrene resin.
3. The device of claim 1 , wherein the connection particles include any one of an Sn-based alloy, an Sn/Bi based alloy, an Sn/Zn based alloy, an Sn/Ag based alloy and an Sn/Ag/Au based alloy, or a mixture of two or more selected from the Sn-based alloy, Sn/Bi based alloy, Sn/Zn based alloy, Sn/Ag based alloy and the Sn/Ag/Au based alloy.
4. The device of claim 1 , wherein the ultrasonic wave bonding unit comprises:
an ultrasonic oscillator configured to output an electric energy at an ultrasonic wave frequency; and
an ultrasonic vibrator configured to convert the electric energy from the ultrasonic oscillator to an ultrasonic wave and apply the ultrasonic wave to the conductive film.
5. The device of claim 1 , wherein the thermo-compression unit comprises:
a power supply unit configured to supply power;
a thermal compressor positioned over the conductive film and configured to apply the heat and pressure to the conductive film based on the power from the power supply unit; and
driving means configured to vertically move the thermal compressor.
6. The device of claim 1 , wherein the controller is further configured to control amplitude and operation time of the ultrasonic wave generated by the ultrasonic wave bonding unit.
7. The device of claim 1 , wherein the first period corresponds to a period when a temperature of the conductive film reaches a prescribed temperature at which the conductive particles of the conductive film starts to melt.