Patent Assignment
Reel/Frame 030029/0547
Assignment of Assignor's Interest
Recorded: 2013-03-18
Pages: 3
Assignors
MORITA, MASAKI
Executed: 2013-02-12
NAKAMURA, KONATSU
Executed: 2013-02-12
TAKANEZAWA, SHIN
Executed: 2013-02-12
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Resin Composition, Cured Resin Product, Wiring Board, and Manufacturing Method for Wiring Board
Application:
13/816,206 →
Publication:
US 2013/0199830