RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTURING METHOD FOR WIRING BOARD
By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.
1 . A resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and having a structural unit derived from an alkylene glycol having a carbon number of from 3 to 10 in a main chain thereof, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator.
2 . The resin composition according to claim 1 , wherein the alkylene glycol having a carbon number of from 3 to 10 is hexanediol.
3 . The resin composition according to claim 1 , wherein an ester equivalent of the ultraviolet ray active ester group-containing compound (B) is from 0.85 to 1.25 equivalents relative to one epoxy equivalent of the epoxy resin (A).
4 . The resin composition according to claim 1 , wherein the ultraviolet ray active ester group-containing compound (B) is a resin having one or more ester groups in one molecule thereof.
5 . A cured resin product obtained by thermally curing the resin composition according to claim 1 and irradiating with ultraviolet rays.
6 . A wiring board obtained by disposing a cured resin layer composed of the cured resin product according to claim 5 on a substrate having a circuit of a wiring conductor and forming a wiring on the cured resin layer by plating.
7 . The wiring board according to claim 6 , wherein the irradiation with ultraviolet rays is performed using an ultraviolet ray lamp capable of undergoing radiation at a maximum wavelength in the range of from 300 to 450 nm in an amount of light of from about 1,000 to 5,000 mJ/cm 2 under an atmospheric pressure atmosphere.
8 . A method of manufacturing a wiring board including (a) a step of forming an uncured resin layer on a substrate having a circuit of a wiring conductor by using a resin composition containing an epoxy resin having two or more epoxy groups in one molecule thereof and having a structural unit derived from an alkylene glycol having a carbon number of from 3 to 10 in a main chain thereof, an ultraviolet ray active ester group-containing compound and an epoxy resin curing accelerator; (b) a step of thermally curing the uncured resin layer and subsequently irradiating with ultraviolet rays to form a cured resin layer; and (c) a step of subjecting the cured resin layer to an electroless plating treatment.
9 . The method for manufacturing a wiring board according to claim 8 , further including (d) a step of applying an electroplating treatment onto the electroless plating.
10 . The method for manufacturing a wiring board according to claim 8 , including (c′) a step of subjecting the surface of the cured resin layer to a roughening treatment with an oxidizing roughening liquid between the step (b) and the step (c).
11 . The method for manufacturing a wiring board according to claim 8 , wherein in the step of irradiating with ultraviolet rays, ultraviolet rays are irradiated using an ultraviolet ray lamp capable of undergoing radiation at a maximum wavelength in the range of from 300 to 450 nm in an amount of light of from about 1,000 to 5,000 mJ/cm 2 under an atmospheric pressure atmosphere.
12 . A method for manufacturing a wiring board having an insulating resin layer and a wiring formed on the surface of the insulating resin layer, which performs successively
a laminate forming step of forming a laminate having the insulating resin layer and a support,
a hole forming step of providing a hole in the laminate,
a desmearing treatment step of removing a smear within the hole with a desmearing treatment liquid,
a support removal step of removing the support from the laminate, and
a wiring forming step of forming the wiring on the surface of the insulating resin layer from which the support has been removed, wherein
an ultraviolet ray irradiation step of irradiating ultraviolet rays on the surface of the insulating resin layer from which the support has been removed, to enhance an adhesive force to the wiring is included after the laminate forming step and before the wiring forming step.
13 . The method for manufacturing a wiring board according to claim 12 , wherein the support is a synthetic resin film.
14 . The method for manufacturing a wiring board according to claim 12 , wherein the support is a metal foil.
15 . The method for manufacturing a wiring board according to claim 14 , wherein the metal foil is a copper foil.
16 . The method for manufacturing a wiring board according to claim 12 , wherein the insulating resin layer is composed of a thermosetting resin.
17 . The method for manufacturing a wiring board according to claim 16 , wherein the insulating resin layer is obtained from an insulating resin composition containing an epoxy resin, a curing agent, and a curing accelerator of the epoxy resin.
18 . The method for manufacturing a wiring board according to claim 17 , wherein the epoxy resin is an epoxy resin containing a hexanediol structure having two or more epoxy groups in one molecule thereof.
19 . The method for manufacturing a wiring board according to claim 17 , wherein the curing agent is an active ester group-containing compound.
20 . The method for manufacturing a wiring board according to claim 19 , wherein an active ester equivalent of the active ester group-containing compound is from 0.75 to 1.25 equivalents relative to one epoxy equivalent of the epoxy resin.
21 . The method for manufacturing a wiring board according to claim 17 , wherein the curing agent is an active ester group-containing compound having one or more ester groups in one molecule thereof.
22 . The method for manufacturing a wiring board according to claim 12 , wherein in the ultraviolet ray irradiation step, the insulating resin layer is irradiated with ultraviolet rays having a wavelength of from 300 to 450 nm in an irradiation amount of from 1,000 to 5,000 mJ/cm 2 at atmospheric pressure.
23 . The method for manufacturing a wiring board according to claim 12 , which performs successively
a laminate forming step of forming a laminate having a support and an insulating resin layer,
a hole forming step of providing a hole in the laminate,
a desmearing treatment step of removing a smear within the hole with a desmearing treatment liquid,
a support removal step of removing the support from the laminate,
an ultraviolet ray irradiation step of irradiating ultraviolet rays on the insulating resin layer from the support side of the laminate, and
a wiring forming step of forming the wiring on the surface of the insulating resin layer from which the support has been removed.
24 . The method for manufacturing a wiring board according to claim 12 , which performs successively
a laminate forming step of forming a laminate having a support and an insulating resin layer,
a hole forming step of providing a hole in the laminate,
an ultraviolet ray irradiation step of irradiating ultraviolet rays on the insulating resin layer from the support side of the laminate,
a desmearing treatment step of removing a smear within the hole with a desmearing treatment liquid,
a support removal step of removing the support from the laminate, and
a wiring forming step of forming the wiring on the surface of the insulating resin layer from which the support has, been removed.
25 . The method for manufacturing a wiring board according to claim 12 , which performs successively
a laminate forming step of forming a laminate having a support and an insulating resin layer,
a hole forming step of providing a hole in the laminate,
a desmearing treatment step of removing a smear within the hole with a desmearing treatment liquid,
an ultraviolet ray irradiation step of irradiating ultraviolet rays on the insulating resin layer from the support side of the laminate,
a support removal step of removing the support from the laminate, and
a wiring forming step of forming the wiring on the surface of the insulating resin layer from which the support has been removed.