Patent Assignment
Reel/Frame 030029/0880
Assignment of Assignor's Interest
Recorded: 2013-03-18
Pages: 2
Assignor
KIM, HYUNG-KYUN
Executed: 2013-03-14
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Forming Void-Free Polysilicon and Method for Fabricating Semiconductor Device Using the Same