Method for forming void-free polysilicon and method for fabricating semiconductor device using the same
A method for fabricating a semiconductor device includes forming a buried gate electrode in a semiconductor substrate. An insulating layer is formed over the buried gate electrode and is etched to form a contact hole exposing the semiconductor substrate. A sacrificial spacer is formed on sidewalls of the insulating layer defining the contact hole. A polysilicon layer pattern is formed in the contact hole. The sacrificial spacer is removed to form an air gap around the polysilicon layer pattern. A thermal process is performed to remove a seam existing in the polysilicon layer pattern.
1. A method for fabricating a semiconductor device, the method comprising:
forming a second layer over a first layer;
forming an open portion by etching the second layer;
forming a sacrificial layer on sidewalls of the second layer defining the open portion;
forming a polysilicon layer pattern in the open portion;
removing the sacrificial layer to form a gap between the polysilicon layer pattern and the second layer, wherein the gap exposes sidewalls and a top surface of the polysilicon layer pattern; and
performing a thermal process to diffuse a seam in the polysilicon layer pattern to the exposed sidewalls and the top surface of the polysilicon layer pattern after the removing the sacrificial layer,
wherein the thermal process is performed at a temperature range from 500° C. to 800° C. with a furnace annealing.
2. The method of claim 1 , further comprising:
forming a capping layer to fill the gap, after the performing the thermal process.
3. The method of claim 1 , wherein the forming the polysilicon layer pattern comprises:
forming a polysilicon layer over the second layer to fill the open portion; and
etching back the polysilicon layer.
4. The method of claim 1 , wherein the sacrificial layer comprises titanium nitride, silicon oxide, or boron nitride.