IP Library Assignment 030187/0307
Patent Assignment
Reel/Frame 030187/0307

Assignment of Assignor's Interest

Recorded: 2013-04-10 Pages: 2
Assignor
TSUBOTA, YASUTOSHI
Executed: 2013-02-18
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Patent: 9,147,573 →
Application: 13/769,505 →
Publication: US 2014/0057456
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →