Substrate processing apparatus and method of manufacturing semiconductor device
View Patent ↗The substrate processing apparatus includes a process chamber; a susceptor configured to support a wafer; lifter pins configured to support the wafer on the susceptor; a gas supply unit configured to supply a gas into the process chamber; a heating unit configured to heat the wafer; an excitation unit configured to excite the gas supplied into the process chamber; an exhaust unit configured to exhaust the inside of the process chamber; and a controller. The controller controls a reducing gas to be supplied into the process chamber in a state in which the wafer is supported by the lifter pins, and controls the gas supply unit to supply an oxidizing gas and a reducing gas into the process chamber in a state in which the wafer is supported by the susceptor.
1. A method of manufacturing a semiconductor device, comprising:
(a) loading a substrate to be processed into a process chamber;
(b) heating the substrate after (a); and
(c) processing the substrate after (b),
wherein (b) comprises:
(b-1) placing the substrate on front ends of lifter pins configured to support the substrate at a position higher than that of an upper surface of a susceptor, wherein the susceptor and the lifter pins are provided inside the process chamber;
(b-2) supplying a reducing gas into the process chamber using a gas supply unit while the substrate is placed on the front ends of the lifter pins; and
(b-3) heating the substrate placed on the front ends of the lifter pins using a heating unit, and
(c) comprises:
(c-1) placing the substrate heated in (b) on the upper surface of the susceptor;
(c-2) heating the substrate placed on the upper surface of the susceptor using the heating unit;
(c-3) supplying an oxidizing gas and the reducing gas into the process chamber using the gas supply unit;
(c-4) exciting the oxidizing gas and the reducing gas in the processing chamber using an excitation unit while the substrate is placed on the susceptor; and
(c-5) exhausting the process chamber using an exhaust unit.
2. The method of claim 1 , further comprising:
(d) suspending the supplying of the oxidizing gas and the reducing gas after (c-4),
wherein (d) comprises:
(d-1) suspending a supply of the oxidizing gas; and
(d-2) suspending a supply of the reducing gas after the supply of the oxidizing gas is suspended.
3. The method of claim 2 , wherein the substrate is supported on the front ends of the lifter pins during at least one of (d-1) and (d-2).
4. The method of claim 1 , wherein the reducing gas comprises hydrogen gas.
5. The method of claim 1 , wherein the inside pressure of the process chamber during (b) is higher than that of (a).
6. The method of claim 1 , wherein the substrate comprises a plurality of convex structures including a stacked structure of a metal element-containing film and a silicon-containing film.
7. The method of claim 4 , wherein (b) further comprises:
(b-4) exhausting an inside of the process chamber using the exhaust unit after (b-1).
8. The method of claim 1 , wherein a space is formed below a lower surface of the substrate and the reducing gas is supplied to the lower surface of the substrate while performing (b).
9. The method of claim 1 , wherein (b-3) further comprises:
heating the substrate placed on the front ends of the lifter pins from above and below the substrate.
10. The method of claim 9 , wherein (b-3) further comprises:
heating the substrate from below the substrate by the susceptor while the susceptor is positioned below the front ends of the lifter pins.
11. The method of claim 1 , wherein (b-2) further comprises:
supplying the reducing gas into the process chamber excluding the oxidization gas and without exciting the reducing gas using the excitation unit until (c-4).