IP Library Assignment 030207/0977
Patent Assignment
Reel/Frame 030207/0977

Assignment of Assignor's Interest

Recorded: 2013-04-12 Pages: 4
Assignor
LAO, KEITH QUOC
Executed: 2013-03-28
Assignees
SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
12100 SAMSUNG BLVD, AUSTIN, TEXAS, 78754
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property (1)
Forming Vias and Trenches for Self-Aligned Contacts in a Semiconductor Structure
Patent: 9,287,162 →
Application: 13/738,629 →
Publication: US 2014/0191409
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 31, 2018
From: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
To: SAMSUNG AUSTIN SEMICONDUCTOR, LLC
Reel/Frame 047006/0105 →