Patent Assignment
Reel/Frame 047006/0105
Change of Name
Recorded: 2018-08-31
Pages: 6
Assignor
SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
Executed: 2005-08-03
Assignee
SAMSUNG AUSTIN SEMICONDUCTOR, LLC
1209 ORANGE STREET, WILMINGTON, NEW CASTLE COUNTY, DELAWARE, 19801
Covered Properties
(24)
Methods of Fabricating a Memory Device
Patent:
6,403,455 →
Application:
09/653,228 →
Plasma Coil
Semiconductor Workpiece Apparatus
High Selectivity Slurry Delivery System
Polish pad tool
Application:
10/693,089 →
Publication:
US 2005/0088001
Apparatus and Method for Breaking in Multiple Pad Conditioning Disks for Use in a Chemical Mechanical Polishing System
Off-Line Tool for Breaking in Multiple Pad Conditioning Disks Used in a Chemical Mechanical Polishing System
Plasma reaction chamber and captive silicon electrode plate for processing semiconductor wafers
Application:
10/993,136 →
Publication:
US 2006/0108069
High Selectivity Slurry Delivery System
Semiconductor Workpiece Apparatus
Fuzzy Logic System for Process Control in Chemical Mechanical Polishing
Rupture Resistant Plasma Tube
Off-Line Tool for Breaking in Multiple Pad Conditioning Disks Used in a Chemical Mechanical Polishing System
Selective Imaging Through Dual Photoresist Layers
System and Method for Haze Control in Semiconductor Processes
Hot edge ring apparatus and method for increased etch rate uniformity and reduced polymer buildup
Application:
11/805,100 →
Publication:
US 2008/0289766
Apparatus for agitating and evacuating byproduct dust from a semiconductor processing chamber
Parallel Multi Wafer Axial Spin Clean Processing Using Spin Cassette Inside Movable Process Chamber
Application:
13/011,052 →
Publication:
US 2012/0189421
Removable Transparent Membrane for a Pellicle
Method and Apparatus for Fabrication of Carbon Nanotubes Using an Electrostatically Charged Substrate and Liner
Multi-Level Stack Having Multi-Level Contact and Method
Semiconductor Manufacturing Equipment with Trace Elements for Improved Defect Tracing and Methods of Manufacture
Forming Vias and Trenches for Self-Aligned Contacts in a Semiconductor Structure
Multi-Level Stack Having Multi-Level Contact and Method
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 6, 2000
From: EL-HAMDI, MOHAMED; SAWAYA, SAM; BALFOUR, SCOTT; SEMAAN, LOUAY
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
Reel/Frame 011226/0244 →
Assignment of Assignor's Interest
Nov 30, 2001
From: LEONE, MIKE; GERNERT, JIM; SUN, WEI
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
Reel/Frame 012340/0618 →
Assignment of Assignor's Interest
Sep 30, 2002
From: LOO, JOHN
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO. LTD.
Reel/Frame 013348/0232 →
Assignment of Assignor's Interest
Mar 25, 2003
From: LUJAN, RANDALL; ALI, AHMED; GAREL, MICHELLE; TUCKER, JOSH
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 013899/0962 →
Assignment of Assignor's Interest
Oct 24, 2003
From: JONES, KELLEY
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 014637/0968 →
Assignment of Assignor's Interest
Jun 22, 2004
From: LUJAN, RANDALL J.
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 015507/0081 →
Assignment of Assignor's Interest
Jun 22, 2004
From: LUJAN, RANDALL J.
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 015506/0511 →
Assignment of Assignor's Interest
Jun 13, 2005
From: GERNERT, JAMES T.
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 016679/0906 →
Assignment of Assignor's Interest
Oct 28, 2005
From: HUANDRA, SUGENTO
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 017171/0091 →
Assignment of Assignor's Interest
Mar 15, 2006
From: HEEMSTRA, DAVID; WHITE, KEVIN
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 017690/0001 →
Assignment of Assignor's Interest
Sep 12, 2006
From: MORRISON, PEDRO; SOUKUP, KEVIN; CHO, DAVID; MENDOZA, KARLA
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018312/0562 →
Assignment of Assignor's Interest
Sep 13, 2006
From: CHEN, XIAOMING; NGUYEN, MAIHAN; ARASAKI, OSAMU; MARAQUIN, TAMMY
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018315/0815 →
Assignment of Assignor's Interest
May 22, 2007
From: HEEMSTRA, DAVID; SILVA, REX; LEONE, MICHAEL; GERNERT, JIM
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
Reel/Frame 019391/0967 →
Assignment of Assignor's Interest
Jun 18, 2007
From: HEEMSTRA, DAVID; SILVA, REX; LEONE, MICHAEL; GERNERT, JIM
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 019443/0316 →
Assignment of Assignor's Interest
Aug 13, 2010
From: MCCORMICK, ERIC; MENDEZ, ROLANDO; MAY, BRADLEY
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
Reel/Frame 024890/0066 →
Assignment of Assignor's Interest
Jan 21, 2011
From: BRAR, AMULDEEP S.; LEE, NAMPYO; HAN, WOOSUNG
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025676/0536 →
Corrective Assignment to Correct the Filing Date Previuously Recorded on Reel 025676 Frame 0536.
Mar 24, 2011
From: BRAR, AMUIDEEP S.; LEE, NAMPYO; HAN, WOOSUNG
To: SAMSUNG AUSTIN SEMICONDUCTOR, L. P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026027/0707 →
Assignment of Assignor's Interest
Sep 12, 2011
From: LAO, KEITH
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026889/0026 →
Assignment of Assignor's Interest
Aug 31, 2018
From: LUJAN, RANDALL J.
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 046771/0418 →
Assignment of Assignor's Interest
Aug 31, 2018
From: LOO, JOHN
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 046771/0549 →
Assignment of Assignor's Interest
Aug 31, 2018
From: LUJAN, RANDALL; ALI, AHMED; GAREL, MICHELLE; TUCKER, JOSH
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 046771/0522 →