Multi-level stack having multi-level contact and method

1. A method for forming a multi-level stack having a multi-level contact, comprising:

forming a multi-level stack comprising a specified number, n, of conductive layers and at least n−1 insulating layers, the stack having a plurality of outside edges;

forming a via formation layer over the stack;

etching a first via in the via formation layer at a first outside edge of the stack;

etching a second via in the via formation layer at a second outside edge of the stack;

forming a first multi-level contact in the first via; and

forming a second multi-level contact in the second via.

2. The method of claim 1 , wherein the first multi-level contact is configured to connect the conductive layers to each other on the first outside edge of the stack and the second multi-level contact is configured to connect the conductive layers to each other on the second outside edge of the stack.

3. The method of claim 1 , wherein:

the conductive layers comprise a lower conductive layer and upper conductive layers,

the first multi-level contact is configured to connect a first region of a top surface of the lower conductive layer to edges of the upper conductive layers on the first outside edge of the stack, and

the second multi-level contact is configured to connect a second region of the top surface of the lower conductive layer to edges of the upper conductive layers on the second outside edge of the stack.

4. The method of claim 1 , wherein the first multi-level contact is configured to connect the conductive layers to each other on the first outside edge of the stack.

5. The method of claim 1 , wherein:

the conductive layers comprise a lower conductive layer and upper conductive layers, and

the first multi-level contact is configured to connect a first region of a top surface of the lower conductive layer to edges of the upper conductive layers on the first outside edge of the stack.

6. The method of claim 1 , wherein forming the via formation layer comprises depositing the via formation layer and planarizing the via formation layer, the method further comprising:

depositing a photoresist layer over the planarized via formation layer; and

patterning the photoresist layer to expose the via formation layer at the first outside edge of the stack.

7. A method for forming a multi-level stack having a multi-level contact, comprising:

forming a first conductive layer;

forming a first insulating layer over the first conductive layer;

forming a second conductive layer over the first insulating layer without forming contacts in the first insulating layer;

forming a via formation layer over the second conductive layer;

etching a first via into the via formation layer at a first outside edge of the first conductive layer and the second conductive layer;

etching a second via into the via formation layer at a second outside edge of the first conductive layer and the second conductive layer;

forming a first multi-level contact in the first via: and

forming a second multi-level contact in the second via.

8. The method of claim 7 , wherein the first multi-level contact is configured to connect the first and second conductive layers to each other on the first outside edge and the second multi-level contact is configured to connect the first and second conductive layers to each other on the second outside edge.

9. The method of claim 7 , wherein:

the first multi-level contact is configured to connect a first region of a top surface of the first conductive layer to the second conductive layer on the first outside edge, and

the second multi-level contact is configured to connect a second region of the top surface of the first conductive layer to the second conductive layer on the second outside edge.

10. The method of claim 7 , wherein the first multi-level contact is configured to connect the first and second conductive layers to each other on the first outside edge.

11. The method of claim 7 , wherein the first multi-level contact is configured to connect a first region of a top surface of the first conductive layer to the second conductive layer on the first outside edge.

12. The method of claim 7 , further comprising forming additional alternating insulating layers and conductive layers, wherein forming the via formation layer comprises forming the via formation layer over the additional insulating layers and conductive layers.

13. A multi-level stack, comprising:

a specified number, n, of conductive layers;

at least n−1 insulating layers;

a first multi-level contact formed at a first outside edge of the stack; and

a second multi-level contact at a second outside edge of the stack.

14. The multi-level stack of claim 13 , wherein the first multi-level contact is configured to connect the conductive layers to each other on the first outside edge of the stack and the second multi-level contact is configured to connect the conductive layers to each other on the second outside edge of the stack.

15. The multi-level stack of claim 13 , wherein:

the conductive layers comprise a lower conductive layer and upper conductive layers,

the first multi-level contact is configured to connect a first region of a top surface of the lower conductive layer to edges of the upper conductive layers on the first outside edge of the stack, and

the second multi-level contact is configured to connect a second region of the top surface of the lower conductive layer to edges of the upper conductive layers on the second outside edge of the stack.

16. The multi-level stack of claim 13 , wherein the multi-level stack is formed over a buffer layer that is deposited over a substrate.

17. A multi-level stack, comprising:

a specified number, n, of conductive layers;

at least n−1 insulating layers; and

a first multi-level contact formed at a first outside edge of the stack,

wherein the insulating layers are formed between the conductive layers, and wherein the insulating layers are formed without providing contacts between the conductive layers.