Method and apparatus for fabrication of carbon nanotubes using an electrostatically charged substrate and liner
View Patent ↗A system for use in fabrication of carbon nanotubes (CNTs) includes a wafer having a circuitry and a plurality of CNT seed sites. The system also includes a base assembly configured to support the wafer. The system further includes a first tube disposed over the wafer and configured to surround the CNTs that form on the seed sites. The circuitry in the wafer is configured to conduct at least one static charge. The wafer includes a top surface having a plurality of CNT seed sites, each seed site coupled to the circuitry and configured to receive one of the at least one static charge.
1. A system for use in fabrication of carbon nanotubes (CNTs), the system comprising:
a wafer having a circuitry and a plurality of CNT seed sites;
a base assembly configured to support and electrically connect to the wafer; and
a first tube disposed over the wafer and configured to surround the CNTs that form on the seed sites, the first tube comprising a conductive coating configured to generate an electrostatic field inside the first tube.
2. The system of claim 1 , wherein the circuitry in the wafer conducts a static charge at each seed site.
3. The system of claim 1 , wherein the electrostatic field generated inside the first tube exerts a force directed radially inward on the CNTs that form on the seed sites.
4. The system of claim 1 , further comprising a second tube configured to surround the first tube.
5. The system of claim 4 , wherein the second tube comprises a shower head having a plurality of orifices configured to transmit process gasses into the first tube.
6. The system of claim 5 , wherein the first tube comprises a plurality of openings around the perimeter of a bottom portion, the openings configured to allow the process gasses to vent out of the first tube.
7. The system of claim 1 , wherein the base assembly comprises at least one electrical contact configured to transmit a static charge to the wafer.
8. The system of claim 7 , wherein the at least one electrical contact of the base assembly comprises a latch configured to transmit the static charge to an electrical contact of the wafer, the latch further configured to secure the wafer to the base assembly.
9. The system of claim 1 , wherein the base assembly transmits a static charge to the first tube.
10. A method for fabricating carbon nanotubes (CNTs), the method comprising:
placing a wafer on a base assembly, the wafer having a circuitry and a plurality of CNT seed sites, the base assembly configured to support and electrically connect to the wafer;
placing a first tube over the wafer, the first tube comprising a conductive coating;
generating, by the conductive coating, an electrostatic field inside the first tube; and
forming a CNT at each seed site, the CNTs surrounded by the first tube.
11. The method of claim 10 , further comprising:
generating, by the circuitry in the wafer, a static charge at each seed site.
12. The method of claim 10 , wherein the electrostatic field generated inside the first tube exerts a force directed radially inward on the CNTs that form on the seed sites.
13. The method of claim 10 , wherein the base assembly comprises at least one electrical contact configured to transmit a static charge to the wafer.
14. The method of claim 10 , wherein the base assembly transmits a static charge to the first tube.
15. A system for use in fabrication of carbon nanotubes (CNTs), the system comprising:
a wafer having a circuitry and a plurality of CNT seed sites;
a base assembly configured to support and electrically connect to the wafer; and
a first tube disposed over the wafer and configured to surround the CNTs that form on the seed sites, the first tube comprising a conductive coating configured to generate an electrostatic field inside the first tube;
a second tube configured to surround the first tube, the second tube comprising a shower head having a plurality of orifices configured to transmit process gasses into the first tube and an exhaust port configured to provide an outlet for gasses.
16. The system of claim 1 , wherein the circuitry in the wafer conducts a static charge at each seed site.
17. The system of claim 1 , wherein the electrostatic field generated inside the first tube exerts a force directed radially inward on the CNTs that form on the seed sites.
18. The system of claim 5 , wherein the first tube comprises a plurality of openings around the perimeter of a bottom portion, the openings configured to allow the process gasses to vent out of the first tube.
19. The system of claim 1 , wherein the base assembly comprises at least one electrical contact configured to transmit a static charge to the wafer.
20. The system of claim 7 , wherein the at least one electrical contact of the base assembly comprises a latch configured to transmit the static charge to an electrical contact of the wafer, the latch further configured to secure the wafer to the base assembly.