Patent Assignment
Reel/Frame 019443/0316
Assignment of Assignor's Interest
Recorded: 2007-06-18
Pages: 5
Assignors
HEEMSTRA, DAVID
Executed: 2007-05-15
SILVA, REX
Executed: 2007-05-15
LEONE, MICHAEL
Executed: 2007-05-15
GERNERT, JIM
Executed: 2007-05-15
Assignees
SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
12100 SAMSUNG BLVD., AUSTIN, TEXAS, 78754
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Hot edge ring apparatus and method for increased etch rate uniformity and reduced polymer buildup
Application:
11/805,100 →
Publication:
US 2008/0289766
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 22, 2007
From: HEEMSTRA, DAVID; SILVA, REX; LEONE, MICHAEL; GERNERT, JIM
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
Reel/Frame 019391/0967 →
Change of Name
Aug 31, 2018
From: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
To: SAMSUNG AUSTIN SEMICONDUCTOR, LLC
Reel/Frame 047006/0105 →