Patent Assignment
Reel/Frame 019391/0967
Assignment of Assignor's Interest
Recorded: 2007-05-22
Pages: 3
Assignors
HEEMSTRA, DAVID
Executed: 2007-05-08
SILVA, REX
Executed: 2007-05-15
LEONE, MICHAEL
Executed: 2007-05-04
GERNERT, JIM
Executed: 2007-05-02
Assignee
SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
12100 SAMSUNG BOULEVARD, AUSTIN, TEXAS, 78754
Covered Property
(1)
Hot edge ring apparatus and method for increased etch rate uniformity and reduced polymer buildup
Application:
11/805,100 →
Publication:
US 2008/0289766
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 18, 2007
From: HEEMSTRA, DAVID; SILVA, REX; LEONE, MICHAEL; GERNERT, JIM
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 019443/0316 →
Change of Name
Aug 31, 2018
From: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
To: SAMSUNG AUSTIN SEMICONDUCTOR, LLC
Reel/Frame 047006/0105 →