IP Library Granted Patent US 7,371,156
Granted Patent B2
US 7,371,156 · App. 11/507,360 · Granted May 13, 2008

Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system

Assignees: Samsung Electronics Co., Ltd.; Samsung Austin Semiconductor, L.P.
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Quick Facts
Patent No.
US 7,371,156
App. No.
11/507,360
Granted
May 13, 2008
Kind
B2
Abstract

An off-line tool for breaking in pad conditioning disks used in a chemical mechanical polishing (CMP) system. The off-line tool comprises a platen having a first surface for holding a polishing pad and a motor for rotating the polishing pad. The motor is coupled to the platen via a first drive shaft. The off-line tool further comprises a mechanical drive assembly for holding a second drive shaft in a position proximate the first surface of the platen and a first break-in head removably attached to the second drive shaft. The first break-in head receives a first pad conditioning disk and the second drive shaft moves the first break-in head toward the platen, thereby pressing the first pad conditioning disk against the polishing pad on the platen.

Claims (22)

1. An off-line tool for breaking in pad conditioning disks used in a chemical mechanical polishing (CMP) system, said off-line tool comprising:

a platen having a first surface for mounting a polishing pad thereon;

a motor for rotating said polishing pad, wherein said motor is coupled to said platen via a first drive shaft;

a mechanical drive assembly capable of holding a second drive shaft in a position proximate said first surface of said platen, the motor powering a rotation of the second drive shaft; and

a first break-in head capable of being removably attached to said second drive shaft, wherein said first break-in head is adapted to receive a first pad conditioning disk, and wherein said second drive shaft is operable to move said first break-in head toward said platen, therein pressing said first pad condition disk against said polishing pad mounted on said first surface of said platen.

2. The off-line tool as set forth in claim 1 wherein said mechanical drive assembly is capable of holding a third drive shaft in a position proximate said first surface of said platen.

3. The off-line tool as set forth in claim 2 further comprising a second break-in head capable of being removably attached to said third drive shaft, wherein said second break-in head is adapted to receive a second pad conditioning disk, and wherein said third drive shaft is operable to move said second break-in head toward said platen, thereby pressing said second pad conditioning disk against said polishing pad.

4. The off-line tool as set forth in claim 3 wherein said mechanical drive assembly is capable of rotating said second and third drive shafts.

5. The off-line tool as set forth in claim 1 wherein said first break-in head is adapted to receive a first plurality of pad conditioning disks.

6. The off-line tool as set forth in claim 3 wherein said second break-in head is adapted to receive a second plurality of pad conditioning disks.

7. The off-line tool as set forth in claim 4 wherein said mechanical drive assembly couples said first drive shaft to said second and third drive shafts such that rotation of said first drive shaft causes rotation of said second and third drive shafts.

8. The off-line tool as set forth in claim 1 wherein said first break-in head comprises a first drive mechanism capable of rotating said first pad conditioning disk.

9. The off-line tool as set forth in claim 8 wherein said first drive mechanism is coupled to said second drive shaft and rotates said first pad conditioning disk by translating a rotating motion of said second drive shaft into a rotating motion of said first pad conditioning disk.

10. The off-line tool as set forth in claim 8 wherein said first drive mechanism comprises a first gear assembly coupled to said second drive shaft and to a first spindle connected to said first pad conditioning disk.

11. The off-line tool as set forth in claim 3 wherein said second break-in head comprises a second drive mechanism capable of rotating said second pad conditioning disk.

12. The off-line tool as set forth in claim 11 wherein said second drive mechanism is coupled to said third drive shaft and rotates said second pad conditioning disk by translating a rotating motion of said third drive shaft into a rotating motion of said second pad conditioning disk.

13. The off-line tool as set forth in claim 11 wherein said second drive mechanism comprises a second gear assembly coupled to said third drive shaft and to a second spindle connected to said second pad conditioning disk.

14. The off-line tool as set forth in claim 1 wherein said first break-in head is adapted to receive a first plurality of pad conditioning disks and to press said first plurality of pad conditioning disks against said polishing pad.

15. The off-line tool as set forth in claim 14 wherein said first break-in head comprises a first drive mechanism capable of rotating said first plurality of pad conditioning disks.

16. The off-line tool as set forth in claim 3 wherein said second break-in head is adapted to receive a second plurality of pad conditioning disks and to press said second plurality of pad conditioning disks against said polishing pad.

17. The off-line tool as set forth in claim 16 wherein said second break-in head comprises a second drive mechanism capable of rotating said second plurality of pad conditioning disks.

18. The off line tool as set forth in claim 17 wherein said second drive mechanism is coupled to said third drive shaft and rotates said second plurality of pad conditioning disks by translating a rotating motion of said third drive shaft into rotating motions of said second plurality of pad conditioning disks, and wherein said second drive mechanism comprises a second gear assembly coupled to said second drive shaft and to each of a second plurality of spindles connected to said second plurality of pad conditioning disks.

Assignments (2)
CHANGE OF NAME Recorded Aug 31, 2018
From: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
To: SAMSUNG AUSTIN SEMICONDUCTOR, LLC
Reel/Frame 047006/0105 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 31, 2018
From: LUJAN, RANDALL J.
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 046771/0418 →
Continuity (2)
Continuation 1087355800 · Jun 22, 2004
Related Publication 20070066189A1 · Mar 22, 2007