IP Library Patent Application 10693089
Patent Application
App. No. 10/693,089

Polish pad tool

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Quick Facts
Patent No.
US None
App. No.
10/693,089
Abstract

A tool for lifting a pad, such as a CMP polish pad, is provided that includes a jaw that has an upper jaw portion and a lower jaw portion. The lower jaw portion has a sloped upper surface for slidably receiving a portion of the pad. A first member is pivotally coupled to the jaw. A second member is pivotally coupled to the first member. The second member has a surface opposite to the sloped surface of the lower jaw portion. The surface is operable to clamp the portion of the pad against the sloped surface when the first member is pivoted upwards.

Claims (29)

1 . A tool for lifting a pad, comprising:

a jaw having an upper jaw portion and a lower jaw portion, the lower jaw portion having a sloped upper surface for slidably receiving a portion of the pad;

a first member pivotally coupled to the jaw; and

a second member pivotally coupled to the first member, the second member having a surface opposite to the sloped surface of the lower jaw portion and operable for clamping the portion of the pad against the sloped surface when the first member is pivoted upwards.

2 . The tool of claim 1 , wherein the upper jaw portion has an arcuate lower surface.

3 . The tool of claim 2 , wherein the jaw is arcuate.

4 . The tool of claim 1 , wherein the jaw comprises a first half coupled to a second half.

5 . The tool of claim 1 , wherein the lower jaw portion comprises a substantially flat lower surface.

6 . The tool of claim 1 , wherein the first member comprises a cutout in which a portion of the second member is pivotally positioned.

7 . The tool of claim 1 , wherein the surface of the second member comprises a textured surface.

8 . A chemical mechanical polishing pad removal tool, comprising:

a jaw having an upper jaw portion and a lower jaw portion, the upper jaw portion having an arcuate lower surface for contacting portions of an upper surface of the chemical mechanical polishing pad, the lower jaw portion having a sloped upper surface spaced below and opposite to the arcuate lower surface for slidably receiving a portion of the pad;

a first member pivotally coupled to the jaw; and

a second member pivotally coupled to the first member, the second member having a surface projecting below the arcuate lower surface of the upper jaw portion and being opposite to the sloped surface of the lower jaw portion, the second surface being operable for clamping the portion of the pad against the sloped surface when the first member is pivoted upwards.

9 . The tool of claim 8 , wherein the jaw is acuate.

10 . The tool of claim 8 , wherein the jaw comprises a first half coupled to a second half.

11 . The tool of claim 8 , wherein the lower jaw portion comprises a substantially flat lower surface.

12 . The tool of claim 8 , wherein the first member comprises a cutout in which a portion of the second member is pivotally positioned.

13 . The tool of claim 12 , comprising a cap coupled to the first member to laterally enclose the cutout.

14 . The tool of claim 8 , wherein the surface of the second member comprises a textured surface.

15 . A chemical mechanical polishing pad removal tool; comprising:

a jaw having an upper jaw portion and a lower jaw portion, the upper jaw portion having an acuate lower surface for contacting portions of an upper surface of the chemical mechanical polishing pad, the lower jaw portion having a sloped upper surface spaced below and opposite to the arcuate lower surface for slidably receiving a portion of the pad, the sloped upper surface terminating at a lower end in a rounded end;

a handle pivotally coupled to the jaw; and

a member pivotally coupled to the handle, the member having a textured surface projecting below the arcuate lower surface of the upper jaw portion and being opposite to the sloped surface of the lower jaw portion, the textured surface being operable for clamping the portion of the pad against the sloped surface when the handle is pivoted upwards.

16 . The pad removal tool of claim 15 , wherein the jaw is arcuate.

17 . The pad removal tool of claim 15 , wherein the jaw comprises a first half coupled to a second half.

18 . The pad removal tool of claim 15 , wherein the lower jaw portion comprises a substantially flat lower surface.

19 . The pad removal tool of claim 15 , wherein the handle comprises a cutout in which a portion of the second member is pivotally positioned.

20 . The tool of claim 15 , comprising a cap coupled to the first member to laterally enclose the cutout.

Assignments (2)
CHANGE OF NAME Recorded Aug 31, 2018
From: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.
To: SAMSUNG AUSTIN SEMICONDUCTOR, LLC
Reel/Frame 047006/0105 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2003
From: JONES, KELLEY
To: SAMSUNG AUSTIN SEMICONDUCTOR, L.P.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 014637/0968 →