Apparatus and method for breaking in multiple pad conditioning disks for use in a chemical mechanical polishing system
View Patent ↗An apparatus for breaking in new pad conditioning disks for use in a chemical mechanical polishing (CMP) system that polishes a semiconductor wafer by pressing the semiconductor wafer against a moving polishing pad. The apparatus comprises a break-in head that is removably attached to a drive shaft to which a polishing head that holds the semiconductor wafer is normally attached. The break-in head holds multiple pad conditioning disks and presses the plurality of pad conditioning disks against the moving polishing pad. The break-in head comprises a drive mechanism for rotating the multiple pad conditioning disks. The drive mechanism is coupled to the drive shaft and rotates the multiple pad conditioning disks by translating a rotating motion of the drive shaft into rotating motions of the multiple pad conditioning disks.
1. For use in a chemical mechanical polishing (CMP) system that polishes a semiconductor wafer by pressing the semiconductor wafer against a moving polishing pad, an apparatus for breaking in new pad conditioning disks comprising:
a break-in head capable of being removably attached to a drive shaft to which a polishing head that holds the semiconductor wafer is normally attached, wherein the break-in head is adapted to receive and to hold a plurality of pad conditioning disks and to press said pad conditioning disks against said moving polishing pad, and wherein a gear assembly of a drive mechanism is coupled to said drive shaft and to a plurality of spindles for rotating said spindles and said pad conditioning disks.
2. The apparatus as set forth in claim 1 wherein said drive mechanism rotates said at least one of said pad conditioning disks by translating a motion of said drive shaft into a motion of said at least one of said pad conditioning disks.
3. The apparatus as set forth in claim 2 wherein said drive mechanism rotates said at least one of said pad conditioning disks by translating a rotating motion of said drive shaft into a rotating motion of said at least one of said pad conditioning disks.
4. The apparatus as set forth in claim 1 wherein said gear assembly comprises a center gear coupled to said drive shaft and a drive gear coupled to one of said spindles.
5. The apparatus as set forth in claim 4 wherein said gear assembly further comprises a transfer gear that interacts with said center gear and said drive gear to transfer rotating motion between said center gear and said drive gear.
6. The apparatus as set forth in claim 1 each of said plurality of spindles is connected to at least one of said plurality of pad conditioning disks.
7. The apparatus as set forth in claim 6 wherein said gear assembly comprises a center gear coupled to said drive shaft and a first drive gear coupled to a first one of said plurality of spindles.
8. The apparatus as set forth in claim 7 wherein said gear assembly further comprises a first transfer gear that interacts with said center gear and said first drive gear to transfer rotating motion between said center gear and said first drive gear.
9. The apparatus as set forth in claim 8 wherein said gear assembly further comprises a second drive gear coupled to a second one of said plurality of spindles.
10. The apparatus as set forth in claim 9 wherein said gear assembly further comprises a second transfer gear that interacts with said center gear and said second drive gear to transfer rotating motion between said center gear and said second drive gear.