Apparatus for agitating and evacuating byproduct dust from a semiconductor processing chamber
View Patent ↗A system and method for semiconductor processing chamber includes a housing that can cover an annular gap of a pedestal well of the semiconductor processing chamber. A cleaning nozzle is removably coupled to a compressed dry air (CDA) supply. The cleaning nozzle can inject the CDA into the pedestal well while the housing can contain a byproduct dust agitated by the injected CDA. The byproduct dust is evacuated by at least one vacuum port that is removably coupled to a vacuum source.
1. An apparatus for cleaning a semiconductor processing chamber, the apparatus comprising:
a housing configured to cover an annular gap of a pedestal well of the semiconductor processing chamber;
at least one cleaning nozzle configured to inject a gas into the pedestal well, such that the injected gas agitates a byproduct disposed on at least one surface within the housing, the at least one cleaning nozzle comprising a fan configured to deliver the gas to a specified portion of the pedestal well;
at least one vacuum port configured to evacuate the agitated byproduct.
2. The apparatus of claim 1 , wherein the at least one cleaning nozzle comprises a polywhip line configured to randomly distribute the gas.
3. The apparatus of claim 1 , wherein the fan is a ninety-degree fan configured to deliver the gas at an angle substantially perpendicular to a wall of the pedestal well.
4. The apparatus of claim 1 , wherein the at least one cleaning nozzle comprises a selector switch configured to select one of: a polywhip line; a ninety-degree fan, and closed position, wherein the closed position inhibits a flow of the gas into the pedestal well.
5. The apparatus of claim 1 , wherein the housing comprises an O-ring configured to inhibit flow of the byproduct from the pedestal well.
6. The apparatus of claim 1 , wherein the housing comprises at least one view port configured to enable an operator to view at least one of: the agitation of the byproduct and the evacuation of the byproduct.
7. The apparatus of claim 1 , wherein the housing does not cover a center portion of a pedestal in the pedestal well of the semiconductor processing chamber.
8. A system for cleaning a semiconductor processing chamber, the system comprising:
a housing configured to cover an annular gap of a pedestal well of the semiconductor processing chamber;
at least one cleaning nozzle removably coupled to a compressed dry air (CDA) supply and configured to inject CDA into the pedestal well, such that the injected CDA agitates a byproduct disposed on at least one surface within the housing, the at least one cleaning nozzle comprises a fan configured to deliver the CDA to a bottom portion of a pedestal within the pedestal well;
at least one vacuum port removably coupled to a vacuum source and configured to evacuate the agitated byproduct.
9. The system of claim 8 , wherein the at least one cleaning nozzle comprises a polywhip line configured to randomly distribute the CDA.
10. The system of claim 8 , wherein the fan is a ninety-degree fan configured to deliver the CDA at an angle substantially perpendicular to a wall of the pedestal well.
11. The system of claim 8 , wherein the at least one cleaning nozzle comprises a selector switch configured to select one of: a polywhip line; a ninety-degree fan, and closed position, wherein the closed position inhibits a flow of the CDA into the pedestal well.
12. The system of claim 8 , wherein the housing comprises an O-ring configured to form a seal at the junction between the housing and the semiconductor processing chamber in order to inhibit flow of the byproduct from the pedestal well.
13. The system of claim 8 , wherein the housing comprises at least one view port configured to enable an operator to view at least one of: the agitation of the byproduct and the evacuation of the byproduct.
14. The system of claim 8 , wherein the housing does not cover a center portion of a pedestal in the pedestal well of the semiconductor processing chamber.
15. The system of claim 8 , further comprising the semiconductor processing chamber.
16. A method for cleaning a semiconductor processing chamber, the method comprising:
covering, by a housing, an annular gap of a pedestal well of the semiconductor processing chamber;
injecting, by at least one cleaning nozzle, a gas into the pedestal well;
delivering, by a fan, the injected gas to a specified portion of the pedestal well;
agitating, by the injected gas, a byproduct disposed on at least one surface within the housing;
evacuating, by at least one vacuum port, the agitated byproduct.
17. The method of claim 16 , wherein injecting comprises randomly distributing the gas by a polywhip line.
18. The method claim 16 , wherein injecting comprises delivering the gas at an angle substantially perpendicular to a wall of the pedestal well.
19. The method of claim 16 , wherein injecting comprises setting a cleaning nozzle to one of: a polywhip line; a ninety-degree fan, and closed position, wherein the closed position inhibits a flow of the gas into the pedestal well.
20. The method of claim 16 , wherein containing comprises inhibiting, by an O-ring, a flow of the byproduct from the pedestal well.