IP Library › Assignment 030234/0846
Patent Assignment
Reel/Frame 030234/0846

Assignment of Assignor's Interest

Recorded: 2013-04-17 Pages: 2
Assignors
CHIOU, WEN-CHIH
Executed: 2010-04-14
WU, WENG-JIN
Executed: 2010-04-14
SHUE, SHAU-LIN
Executed: 2010-04-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property (1)
Protection Layer for Adhesive Material at Wafer Edge
Patent: 9,997,440 →
Application: 13/864,676 →
Publication: US 2013/0228920
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →