Protection layer for adhesive material at wafer edge
A three-dimensional integrated circuit (3DIC) including a first substrate having a first surface and a second surface opposite to the first surface and a second substrate attached to the first surface of the first substrate. The 3DIC further includes an interconnect between attached to the first surface of the first substrate and the second substrate and a plurality of through vias formed in the first substrate and electrically coupled to the interconnect. The 3DIC further includes a protection layer over the second surface of the first substrate, wherein each of the plurality of through vias protrudes through the protection layer and a plurality of dies, each die of the plurality of dies attached to at least one through via of the plurality of through vias.
1. A three-dimensional integrated circuit, comprising:
a first substrate having a first surface and a second surface opposite to the first surface, wherein the first substrate has a thickness ranging from about 5 micrometers (μm) to about 50 μm;
a second substrate attached to the first surface of the first substrate;
an interconnect between attached to the first surface of the first substrate and the second substrate;
a plurality of through vias formed in the first substrate and electrically coupled to the interconnect;
a protection layer over the second surface of the first substrate, wherein each of the plurality of through vias protrudes through the protection layer; and
a plurality of dies, each die of the plurality of dies attached to at least one through via of the plurality of through vias.
2. The 3DIC of claim 1 , wherein the protection layer comprises at least one of an oxide film, a nitride film, a carbide film, a polymer-based material, a resin-based material, polyimide, or a spin-on material.
3. The 3DIC of claim 1 , further comprising at least one conductive structure configured to attach each of the plurality of dies to at least one of the plurality of through vias.
4. The 3DIC of claim 3 , wherein the at least one conductive structure comprises at least one solder bump or at least one copper bump.
5. The 3DIC of claim 3 , wherein the at least one conductive structure comprises a redistribution layer.
6. The 3DIC of claim 1 , wherein each die of the plurality of dies comprises at least one of a memory chip, a radio frequency chip, or a logic chip.
7. The 3DIC of claim 1 , wherein the second substrate comprises at least one of glass, metal, ceramic, or polymer.
8. The 3DIC of claim 1 , wherein each through via of the plurality of through vias are electrically coupled to a bond pad on the first surface of the first substrate and to a die of the plurality of dies on a second surface of the first substrate.
9. The 3DIC of claim 1 , wherein the second substrate is an integrated circuit card, and the second substrate is attached to the first substrate through an anisotropically conductive connection film.
10. A three-dimensional integrated circuit, comprising:
a first substrate having a first surface and a second surface opposite to the first surface, wherein the first substrate has a thickness ranging from about 5 micrometers (μm) to about 50 μm;
a second substrate attached to the first surface of the first substrate;
a plurality of bond pads attached to the first surface of the first substrate;
a plurality of through vias formed in the first substrate and electrically coupled to the bond pads;
a protection layer over the second surface of the first substrate, wherein each of the plurality of through vias is free of the protection layer; and
a plurality of dies, each die of the plurality of dies attached to at least one through via of the plurality of through vias.
11. The 3DIC of claim 10 , wherein the protection layer comprises at least one of an oxide film, a nitride film, a carbide film, a polymer-based material, a resin-based material, polyimide, or a spin-on material.
12. The 3DIC of claim 10 , further comprising at least one conductive structure configured to attach each of the plurality of dies to at least one of the plurality of through vias.
13. The 3DIC of claim 12 , wherein the at least one conductive structure comprises at least one solder bump or at least one copper bump.
14. The 3DIC of claim 12 , wherein the at least one conductive structure comprises a redistribution layer.
15. The 3DIC of claim 10 , wherein each die of the plurality of dies comprises at least one of a memory chip, a radio frequency chip, or a logic chip.
16. The 3DIC of claim 10 , wherein the second substrate comprises at least one of glass, metal, ceramic, or polymer.
17. The 3DIC of claim 10 , wherein the second substrate is an integrated circuit card, and the second substrate is attached to the first substrate through an anisotropically conductive connection film.
18. A three-dimensional integrated circuit, comprising:
a substrate having a first surface and a second surface opposite to the first surface, wherein the first substrate has a thickness ranging from about 5 micrometers (μm) to about 50 μm;
an integrated circuit card attached to the first surface of the substrate through an anisotropically conductive connection film;
a plurality of bond pads attached to the first surface of the substrate;
a plurality of through vias formed in the substrate and electrically coupled to the bond pads;
a protection layer over the second surface of the substrate, wherein each of the plurality of through vias extends through the protection layer; and
a plurality of dies, each die of the plurality of dies attached to at least one through via of the plurality of through vias.