Patent Assignment
Reel/Frame 030251/0372
Assignment of Assignor's Interest
Recorded: 2013-04-19
Pages: 4
Assignors
LE NEEL, OLIVIER
Executed: 2013-03-21
KAM, SHIAN-YEU
Executed: 2013-03-21
LOH, TIEN-CHOY
Executed: 2013-03-21
ADNAN, DITTO
Executed: 2013-03-21
CHEW, TZE WEI DENNIS
Executed: 2013-03-21
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Adhesive Bonding Technique for Use with Capacitive Micro-Sensors
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.