Patent Assignment
Reel/Frame 030259/0127
Change of Name
Recorded: 2013-04-22
Pages: 48
Assignor
HYNIX SEMICONDUCTOR INC.
Executed: 2012-03-23
Assignee
SK HYNIX INC.
2091 GYEONGCHUNGDAE-RO, BUBAL-EUP, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Semiconductor Package