Patent Assignment
Reel/Frame 030267/0964
Assignment of Assignor's Interest
Recorded: 2013-04-23
Pages: 4
Assignors
TSAI, YU-PENG
Executed: 2013-04-10
LU, WEN-HSIUNG
Executed: 2013-04-10
CHEN, CHENG-TING
Executed: 2013-04-10
CHEN, HSIEN-WEI
Executed: 2013-04-10
CHENG, MING-DA
Executed: 2013-04-10
LIU, CHUNG-SHI
Executed: 2013-04-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Method for Wafer Separation